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亞太電子

Home > About > Milestones

Milestones
 
2005 May, Establishment of Shenzhen Mingyi Electronics Co., Ltd.
2008 Nov., Establishment of Dalian Yingke Circuit Co., Ltd.
2013 Nov., Establishment of Dalian Asia Pacific Electronics Co., Ltd.
 
DAPE Profile
  • Dalian Asia Pacific Electronics Co., Ltd. (DAPE for short) was developed from Dalian Yingke Circuit Co., Ltd. (established in Nov.2008) As a high-tech enterprise,DAPE has become a manufacturer of multi-layer high density interconnecting printed circuit boards.
    DAPE is located in the scenic city of Dalian,in LinGang Industrial Zone, SanShiLiPu, PuWan New District, with building area more than 24,000 m². Its annual output is 700K m², out of which multi-layer accounts more than 60%.
    DAPE closely follows the development trend in digitization, integration,miniaturization,multifunction electronic products of the world,and is committed to producing PCB such as double-sided,multilayer,HDI,heavy copper power supply board,special carbon board for the high-end markets including automotive electronics,high-speed railway,industrial control,medical equipment, aerospace,military,net work communications,advanced electronics.

    Profile:
    Established on: Nov. 6th, 2013
    Land area: 17,278 ㎡ Plant area: 24,000 ㎡
    Total investment: 300.5 million RMB.
    Registered capital: 60 million RMB
    Employees: 350
    Business Domain: Development, design, manufacturing and sales of double-sided, multi-layer, HDI PCB, LED aluminum PCB, rigid & flexible PCB.
    Production capacity: 60,000m2/month (currently 30,000m2/month)
    Address: No.19,GangLong Street, LinGang Industrial Zone, SanShiLiPu, PuWan New District, Dalian, China.
  • Dalian Asia Pacific Electronics Co., Ltd. (DAPE for short) was developed from Dalian Yingke Circuit Co., Ltd. (established in Nov.2008) As a high-tech enterprise,DAPE has become a manufacturer of multi-layer high density interconnecting printed circuit boards. DAPE is located in the scenic city of Dalian,in LinGang Industrial Zone, SanShiLiPu, PuWan New District, with building area more than 24,000 m². Its annual output is 700K m², out of which multi-layer accounts more than 60%. DAPE closely follows the development trend in digitization, integration,miniaturization,multifunction electronic products of the world,and is committed to producing PCB such as double-sided,multilayer,HDI,heavy copper power supply board,special carbon board for the high-end markets including automotive electronics,high-speed railway,industrial control,medical equipment, aerospace,military,net work communications,advanced electronics. Profile: Established on: Nov. 6th, 2013 Land area: 17,278 ㎡ Plant area: 24,000 ㎡ Total investment: 300.5 million RMB. Registered capital: 60 million RMB Employees: 350 Business Domain: Development, design, manufacturing and sales of double-sided, multi-layer, HDI PCB, LED aluminum PCB, rigid & flexible PCB. Production capacity: 60,000m2/month (currently 30,000m2/month) Address: No.19,GangLong Street, LinGang Industrial Zone, SanShiLiPu, PuWan New District, Dalian, China.
Corporate News
Dalian Asia Pacific Electronics Co., Ltd.@ All rights reserved:ICP15006799 Design Support: Joint Assistance Add: No.19,GangLong Street,LinGang Industrial Zone,SanShiLiPu,PuWan New District,Dalian,116103,China. Tel: +86-411-39956500Fax: +86-411-39956502
Link: Shenzhen Mingyi Electronics Co., Ltd. Contact Us On-line Message Map
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